Japan Semiconductor Innovation 50 (T-3 1970s)
Automatic Wire Bonder (Hitachi and Shinkawa)
Hitachi succeeded in the development of full-automatic wire
bonding machine for transistors, the first such machine in the world, which
incorporated pattern recognition technology, and put it into in-house production
in 1973. Shinkawa Seisakusho started open market business of automatic wire-bonders
in 1977. They were later enhanced to be applied to the assembly of ICs and
LSIs, and they greatly contributed to mass-production of semiconductor products.
Japan secured the top share in the wire bonder business owing to this invention.
Automatic wire bonder developed by Hitachi in 1973
|Quote from Hitachi HP|
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