Japan Semiconductor Innovation 50     (T-3 1970s)

Automatic Wire Bonder (Hitachi and Shinkawa)

Hitachi succeeded in the development of full-automatic wire bonding machine for transistors, the first such machine in the world, which incorporated pattern recognition technology, and put it into in-house production in 1973. Shinkawa Seisakusho started open market business of automatic wire-bonders in 1977. They were later enhanced to be applied to the assembly of ICs and LSIs, and they greatly contributed to mass-production of semiconductor products. Japan secured the top share in the wire bonder business owing to this invention.

Automatic wire bonder developed by Hitachi in 1973

Quote from Hitachi HP


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