Japan Semiconductor Innovation 50     (T-4 1970s)

DISCO ( then Daiichi-Seito ) developed an "Automatic Dicing Machine" as the first such machine in the world in 1975. The previous method was scrubbing by glass cutters. The new method was audacious and epoch making one, using a rotating thin diamond cutting dice of around 40μm thick in the flow of pure water. Damage to the dies and sticking chips were materially decreased and productivity was largely improved. Tokyo-Seimitsu also entered into the market following DISCO, and Japanese manufactures have continued to dominate the market.

Remarks

To main gallery (Packaging Technology 1970s)