44) The Hybrid Champion
Large output thick film, IC “STK003” by Tokyo Sanyo Electric
It was IBM 's "SLT (Solid Logic Technology)" that was dominating
in the hybrid IC market. Circuits were formed on multiple ceramic substrates
by using thick film technology and chip parts, and the substrates were stacked
three-dimensionally and connected with each other. They were used as the logic
circuit elements in the company's third generation computer "360 series"
and became big news.
In contrast, consumer electronics and automotive applications became mainstream
in the Japanese domestic market. Among them, the large output thick film IC
"STK 003" of Tokyo Sanyo Electric as shown in the picture was adopted
in nearly 70% of stereo amplifiers of Japanese stereo audio products, and
became an unexpected hit product. The story that Konosuke Matsushita visited
the company factory upon catching word of this product is still often talked
about to this day.
The secret weapon of this hit product was "IMST (insulated metal substrate
technology)." The surface of the aluminum substrate was oxidized to form
an anodized aluminum layer, and a copper foil coated with an adhesive for
printed circuit board was adhered thereon to prevent the copper foil from
bulging due to the generation of heat.
(Provided by Yoshio Miura)
End of Part-2
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